Wylie WL207F Chip Removal Tool Ultra-Thin

Wylie WL207F Ultra-Thin Chip Removal Tool

The Wylie WL207F high-tenacity precision blade, specifically designed for micro-electronics professionals. It is the ultimate tool for safe removal of integrated circuits (IC), CPUs, and NAND memories from smartphone and tablet motherboards.

Thanks to its extremely sharp profile and calibrated flexibility, it allows for delicate penetration under soldered components and safe removal of epoxy resin (underfill), without risking damage or tearing the delicate underlying PCB pads.

Ultra-Thin Profile: The tip reaches a minimal thickness, allowing it to slide with extreme ease into microscopic spaces between the chip and the motherboard, ensuring smooth and controlled prying. High Tenacity and Flexibility: Made with special materials that offer the perfect balance between flexibility and mechanical resistance. The tool adapts to pressure without breaking or permanently deforming. Ergonomic Handle: Designed to offer a firm and non-slip grip. It ensures maximum stability and precision of hand movements, essential when working for long periods under the microscope.

Product Specifications