Qianli iShuriken BGA Reballing T0.2mm

Qianli iShuriken - T0.2mm Curved Precision BGA Scraper

The Qianli iShuriken is the ideal tool for BGA Reballing specialists. Thanks to its curved blade with a thickness of only 0.2mm, this scraper offers a perfect balance between flexibility and rigidity, making it ideal for pad cleaning and removing epoxy resins (Underfill) from integrated circuits.

Qianli's build quality ensures long-lasting sharpness and superior bending resistance, allowing you to operate under a microscope with absolute control, avoiding damage to the delicate tracks of the motherboard.

? Qianli Technical Excellence:

• Ultra-Thin Thickness: Only 0.2mm to slide under the densest components effortlessly.
• Curved Profile: Ergonomic design for scraping away solder and glue with natural movements.
• High-Strength Steel: Selected metal alloy to maintain the blade edge over time.
• BGA Versatility: Designed for CPU, NAND memories, and power management chips.

? Technical Specifications: