Qianli iShuriken Chisel For BGA Reballing T0.2mm Flat

Qianli iShuriken - T0.2mm Flat Precision BGA Scraper

The Qianli iShuriken with a flat blade represents excellence for chip cleaning and preparation during BGA Reballing. With a thickness of only 0.2mm, this ultra-thin blade allows for perfectly level cleaning of solder residues on motherboard pads.

Thanks to its flat geometry, it is the ideal tool for effectively removing black glue (Underfill) and resin residues, ensuring a clean surface ready for soldering a new component without risking damage to delicate tracks.

? Qianli Technical Excellence:

• T0.2mm Flat Blade: Linear profile for uniform pressure over large chip surfaces.
• High-Flexibility Steel: Designed to prevent snapping and maintain sharpness during intensive use.
• Efficient Removal: Ideal for scraping solder residues and epoxy resins from pads.
• Total Control: Balanced tool for operating with extreme precision under a microscope.

? Technical Specifications: