Relife HW32 Solder Paste 138°

Low Temperature Solder Paste 138°C RELIFE HW32

Maximize the quality of your repairs while respecting the environment with the RELIFE HW32 Low-Temperature Solder Paste (138°C). This special "Eco-Friendly" and Lead-Free formula is designed to offer top-level performance in microsoldering, ensuring maximum safety for the operator and compliance with RoHS directives.

Thanks to its reduced melting point, it is ideal for protecting the most sensitive components from thermal stress, such as smartphone chips, LEDs, plastics, and BGA/SMD components. Its exceptional workability and slow drying allow complex operations like reballing to be performed with extreme calm and precision, ensuring perfect and long-lasting joints.

• 138°C Melting for Full Joints: Melts homogeneously at just 138°C, creating smooth and resistant joints without damaging nearby parts with excessive heat. Effectively prevents soldering defects and false connections. • Fine Texture and Strong Adhesion: The very fine paste composition ensures excellent adhesion (easy to tin). Perfect for use with BGA stencils, it does not create clumps and spreads uniformly. • Slow Drying and Moderate Humidity: Formulated to resist rapid drying once the jar is opened or spread on the board. This allows for continuous and prolonged work (continuous printing) without loss of quality.

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