Relife RT-404 Solder Paste Low Temperature 138°C

Solder Paste Low Temperature 138°C RELIFE RL-404 (40g)

Perform high-end device repairs with complete safety using the RELIFE RL-404 Low Temperature Solder Paste (138°C). Specifically formulated for advanced smartphone repairs (such as iPhone series motherboards) and microelectronics, this product effectively prevents thermal damage to the most sensitive components during soldering and desoldering phases.

Composed of an eco-friendly lead-free alloy (Sn42/Bi58), this paste guarantees excellent printability and perfect adhesion. Its "Lead-Free" formula respects the environment, while the ultra-fine texture ensures smooth work, without slumping and with professional results on every type of circuit.

• Low Melting Point (138°C): Melts rapidly at just 138°C, drastically reducing thermal stress. It is the essential choice for protecting delicate components, plastic connectors, and heat-sensitive chips during hot air rework operations. • Optimal Viscosity (No Sag, No Offset): Ensures extremely precise application through BGA stencils. The paste does not collapse, smear, or shift after application, offering perfect component positioning. • Bright and Full Joints: Despite the low temperature, it creates strong, shiny, and void-free solders (no false welding). Ideal for motherboards, memory chips, sensors, LED displays, and printed circuit boards (PCB/SMD).

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