Relife RL-601L Plus Multifunction Stencil

The Relife RL-601L Plus is a high-precision, multi-functional reballing platform/fixture designed to simplify and improve the efficiency of complex repair operations on motherboards of smartphones, tablets and other electronic devices. This tool is a must-have for technicians who reball BGA (Ball Grid Array) such as CPU, NAND, Wi-Fi IC and other chips.:

The RL-601L Plus is designed to:

📷 Firmly Hold Chips (CPU, NAND, etc.): Provides a stable base and secure locking mechanism for ICs during the process of removing old solder balls and applying new ones (reballing).

🔍 Accurately Align Reballing Stencils: Allows for accurate positioning of BGA stencils (the metal sheets with holes for the solder balls) over the chip, ensuring that the solder paste or solder balls are applied correctly to the pads.

🔧 Make Motherboard Repairs Easier: Some "Plus" models or kits may include adapters or features to work directly on specific sections of motherboards, such as "tin planting" (tinning pads) or component placement.

🎨Improve Efficiency and Precision: Reduces the risk of errors, solder bridges or misalignments, leading to more reliable and professional repairs.