MiJing Z22 MAX Resin Removal and CPU Reballing iPhone (A13-A19 Pro)

MiJing Z22 MAX 2 in 1 Clamp Glue Removal and CPU Reballing

The MiJing Z22 MAX 2 in 1 Multifunction Clamp is a high-precision tool, indispensable in laboratories specializing in motherboard repair. This platform combines two fundamental functions in a single device: resin cleaning (degumming) and pin soldering (reballing) for BGA processors.

Equipped with a smart design, it optimizes workflow by reducing transition times between the cleaning and solder planting phases. The kit includes calibrated BGA stencils for perfect magnetic alignment, allowing safe operation on Apple CPUs from the A13 series up to A19 Pro models.

2 in 1 Multifunction Design: It perfectly integrates a station for safe epoxy glue removal and a platform for chip reballing. It allows completing processor rework at a single workstation, improving efficiency and cleanliness of the operation. Powerful Magnetic Fixture: Equipped with high-strength magnets, the clamp ensures that the stencil and chip remain firmly locked during solder paste application. This prevents any slippage or loss of microscopic components. Wide CPU Compatibility: Designed for the latest generation of mobile phones, it offers targeted support for iPhone CPUs (from A13 to A19 Pro), proving equally compatible and versatile for working with a wide range of processors for Android devices.

Product Specifications