XINZHIZAO iSocket Middle MotherBoard Tester iPhone 17 Series

XINZHIZAO iSocket Middle Board Tester iPhone 17 Series

The XINZHIZAO iSocket is an essential tool for micro-soldering laboratories working on the new iPhone 17 range, including the ultra-thin 17 Air version. This high-precision test jig allows you to temporarily connect the two motherboard layers (sandwich) without reballing or final soldering, enabling rapid diagnostic tests for signal, Wi-Fi, and Face ID.

? Features:

• iPhone 17 Air Support: Designed to perfectly fit the compact and slim structure of the Air model.
• Gold-Plated Pressure Probes: High-quality pins that guarantee stable contact without damaging the board pads.
• "No-Solder" Diagnostics: Verify CPU, Baseband, and NAND functionality before the final board sealing.
• Optimized Dissipation: Open design to prevent component overheating during intensive testing cycles.

? Technical Specifications:

Lab Advantage: Save hours of work by avoiding unnecessary reballing thanks to secure preventive testing on the iPhone 17 series.