AiXun D-0008 Lead Free Solder Paste 138°

AiXun D-0008 - Lead-Free Nano Solder Paste SP-138°C (50g)

The AiXun D-0008 soldering paste is a cutting-edge compound made of thousands of precise nanoparticles, specifically formulated for advanced smartphone maintenance. The SP-138 degree version is the preferred choice for iPhone motherboard reballing and repair.

It ensures delicate, perfectly round, and full solder balls. Thanks to its excellent viscosity and bubble-free formula, it provides superior conductivity and a "tin-climbing" capability that eliminates the need for rework after soldering.

? AiXun Professional Quality:

• Nano-Particle Formula: For precise and uniform application on the smallest pads.
• 138°C Melting Point: Ideal medium temperature to protect sensitive components during reballing.
• Zero Residue & Bubbles: Clean, shiny solders without accidental short circuits.
• Eco-Friendly: 100% lead-free material for environmental and health safety.

? Technical Specifications: